Invention Grant
- Patent Title: Vapor chamber heat sink having a carbon nanotube fluid interface
- Patent Title (中): 具有碳纳米管流体界面的蒸气室散热器
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Application No.: US11748867Application Date: 2007-05-15
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Publication No.: US07732918B2Publication Date: 2010-06-08
- Inventor: Carlos Dangelo , Jason Spitzer
- Applicant: Carlos Dangelo , Jason Spitzer
- Applicant Address: US CA Sunnyvale
- Assignee: Nanoconduction, Inc.
- Current Assignee: Nanoconduction, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Williams, Morgan & Amerson, P.C.
- Main IPC: H01L23/34
- IPC: H01L23/34

Abstract:
An enhanced heat transposer comprised is of a vapor chamber. The surface of the vapor chamber that holds the fluid comprises an array of carbon nanotubes (CNTs) that are grown in a way that enables the fluid to come into maximum contact with the CNTs. The fluid evaporates in the sealed vapor chamber when it is in touch with a hot surface. The vapor comes in contact with a hollow pin-fin structure that provides additional surface area for vapor cooling and heat transfer. The condensed vapor then drops back into the fluid container, and the cycle continues.
Public/Granted literature
- US20080128116A1 VAPOR CHAMBER HEAT SINK HAVING A CARBON NANOTUBE FLUID INTERFACE Public/Granted day:2008-06-05
Information query
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