Invention Grant
- Patent Title: Extensible interface for inter-module communication
- Patent Title (中): 用于模块间通信的可扩展接口
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Application No.: US09823678Application Date: 2001-03-31
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Publication No.: US07730204B2Publication Date: 2010-06-01
- Inventor: Wai H. Pak
- Applicant: Wai H. Pak
- Applicant Address: US CA San Mateo
- Assignee: Siebel Systems, Inc.
- Current Assignee: Siebel Systems, Inc.
- Current Assignee Address: US CA San Mateo
- Agency: Campbell Stephenson
- Main IPC: G06F15/173
- IPC: G06F15/173

Abstract:
A method and apparatus for inter-module communication is disclosed. The method includes forming a message that includes customer relations management system information. The customer relations management system information may include, for example, agent information, work item information, queuing information, statistical information, connection information or rule information, among other such information. The message can be communicated in order to perform a function, such as an agent-related function, a work item-related function, a statistics-related function or an administrative function, for example. The message can be, for example, a command, a request or a notification.
Public/Granted literature
- US20070192415A1 Extensible interface for inter-module communication Public/Granted day:2007-08-16
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