Invention Grant
- Patent Title: Lead-type electronic-part-mounted printed circuit board, method of soldering lead-type electronic part and air-conditioner
- Patent Title (中): 引线型电子部件安装印刷电路板，铅电子部件和空调焊接方法
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Application No.: US11516565Application Date: 2006-09-07
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Publication No.: US07710738B2Publication Date: 2010-05-04
- Inventor: Tsuyoshi Miura
- Applicant: Tsuyoshi Miura
- Applicant Address: JP Chiyoda-Ku, Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Chiyoda-Ku, Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JP2005-259388 20050907
- Main IPC: H05K7/00
- IPC: H05K7/00
Abstract:
A printed circuit board 1 including a group of consecutive soldering lands 3 for soldering a lead-type electronic part 2 with a plurality of leads 2a, includes a solder drawing land 4 having a cross-shaped slit 4a and being provided adjacently to a rearmost portion of the group of the consecutive soldering lands 3.
Public/Granted literature
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