Invention Grant
- Patent Title: Semiconductor chip and semiconductor device including the same
- Patent Title (中): 半导体芯片与半导体器件相同
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Application No.: US12348386Application Date: 2009-01-05
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Publication No.: US07710138B2Publication Date: 2010-05-04
- Inventor: Shinichi Nakatsu , Hideo Isogai , Takehiro Masumoto , Kazuyuki Nishizawa , Toshihide Tsuboi , Kimiharu Etou
- Applicant: Shinichi Nakatsu , Hideo Isogai , Takehiro Masumoto , Kazuyuki Nishizawa , Toshihide Tsuboi , Kimiharu Etou
- Applicant Address: JP Kanagawa
- Assignee: NEC Electronics Corporation
- Current Assignee: NEC Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Young & Thompson
- Priority: JP2005-054968 20050228
- Main IPC: G01R31/26
- IPC: G01R31/26 ; G01R31/28
Abstract:
A semiconductor chip includes a plurality of pads; input/output circuits connected with the plurality of pads, respectively; a product data storage section configured to store a product data; and a setting section configured to set to an active state, each of the input circuits which is connected to one of the plurality of pads used for input to an internal circuit, and each of the output circuits which is connected to one of the plurality of pads used for output from the internal circuit, and set remaining input/output circuits to an inactive state, based on the product data.
Public/Granted literature
- US20090121755A1 SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE INCLUDING THE SAME Public/Granted day:2009-05-14
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