Invention Grant
- Patent Title: Audio power amplifier package
- Patent Title (中): 音频功率放大器封装
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Application No.: US11865647Application Date: 2007-10-01
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Publication No.: US07709963B2Publication Date: 2010-05-04
- Inventor: Kuo-Hung Wu , Po-Yu Li
- Applicant: Kuo-Hung Wu , Po-Yu Li
- Applicant Address: TW
- Assignee: Himax Analogic, Inc.
- Current Assignee: Himax Analogic, Inc.
- Current Assignee Address: TW
- Agency: Hayes Soloway P.C.
- Main IPC: H01L23/12
- IPC: H01L23/12
Abstract:
An audio power amplifier package includes a non-signal lead, a first non-signal pad, a second non-signal pad and a plurality of bonding wires. The first non-signal pad and the second non-signal pad are disposed on a substrate. The bonding wires connect the non-signal lead to the first non-signal pad and the second non-signal pad respectively.
Public/Granted literature
- US20090085229A1 AUDIO POWER AMPLIFIER PACKAGE Public/Granted day:2009-04-02
Information query
IPC分类:
