Invention Grant
- Patent Title: Integrated circuit package system with package integration
- Patent Title (中): 集成电路封装系统，封装集成
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Application No.: US11958838Application Date: 2007-12-18
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Publication No.: US07709944B2Publication Date: 2010-05-04
- Inventor: Heap Hoe Kuan , Seng Guan Chow , Linda Pei Ee Chua , Dioscoro A. Merilo
- Applicant: Heap Hoe Kuan , Seng Guan Chow , Linda Pei Ee Chua , Dioscoro A. Merilo
- Applicant Address: SG Singapore
- Assignee: STATS ChipPac Ltd.
- Current Assignee: STATS ChipPac Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
An integrated circuit package system comprising: providing a package substrate; attaching a base package having a portion of the base package substantially exposed over the package substrate; forming a cavity through the package substrate to the base package; and attaching a device partially in the cavity and connected to the portion of the base package substantially exposed.
Public/Granted literature
- US20090152701A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE INTEGRATION Public/Granted day:2009-06-18
Information query
IPC分类:
