Invention Grant
- Patent Title: Thermistor device
- Patent Title (中): 热敏电阻器件
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Application No.: US10594341Application Date: 2005-03-17
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Publication No.: US07709922B2Publication Date: 2010-05-04
- Inventor: Hidenori Takagi , Yoshinobu Nakamura , Kouhei Fujiwara
- Applicant: Hidenori Takagi , Yoshinobu Nakamura , Kouhei Fujiwara
- Applicant Address: JP Bunkyo-ku, Tokyo JP Koka-shi, Shiga
- Assignee: Toudai TLO, Ltd.,NEC SCHOTT Components Corporation
- Current Assignee: Toudai TLO, Ltd.,NEC SCHOTT Components Corporation
- Current Assignee Address: JP Bunkyo-ku, Tokyo JP Koka-shi, Shiga
- Agency: Christensen O'Connor Johnson Kindness
- Priority: JP2004-079818 20040319
- International Application: PCT/JP2005/004791 WO 20050317
- International Announcement: WO2005/091311 WO 20050929
- Main IPC: H01L31/058
- IPC: H01L31/058

Abstract:
A thermistor device having a high-speed response to temperature and a large ON/OFF ratio at the operating temperature. The thermistor device comprises a first layer of a first material having a positive temperature coefficient of resistance and a second layer of a second material having a semiconductivity and formed directly on the first layer. As the first material changes from conductive to a semiconductive or an insulative at or near the transition temperature TM-I, the interface between the first and second layer changes to a pn junction.
Public/Granted literature
- US20070262408A1 Thermistor Device Public/Granted day:2007-11-15
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