Invention Grant
- Patent Title: Thin film transistor substrate and method for manufacturing the same
- Patent Title (中): 薄膜晶体管基板及其制造方法
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Application No.: US10773333Application Date: 2004-02-09
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Publication No.: US07709904B2Publication Date: 2010-05-04
- Inventor: Hiroshi Okumura
- Applicant: Hiroshi Okumura
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2003-042083 20030220
- Main IPC: H01L29/786
- IPC: H01L29/786

Abstract:
A thin film transistor substrate is provided including a first thin film transistor and a second thin film transistor. The first thin film transistor comprises a first active layer, a first gate insulating film, and a first gate electrode. The second thin film transistor comprises a second active layer formed, a second gate insulating film, and a second gate electrode. A thickness of the second gate insulating film is larger than a thickness of the first gate insulating film, the second active layer has at least two impurity doping regions which overlap the second gate electrode, the first active layer has at least two impurity doping regions formed in a self-aligning manner with respect to the first gate electrode, and the second gate electrode comprises a semiconductor layer.
Public/Granted literature
- US20040195568A1 Thin film transistor substrate and method for manufacturing the same Public/Granted day:2004-10-07
Information query
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