Invention Grant
US07709898B2 Semiconductor protection circuit, method for fabricating the same and method for operating semiconductor protection circuit 有权
半导体保护电路及其制造方法及半导体保护电路的运行方法

  • Patent Title: Semiconductor protection circuit, method for fabricating the same and method for operating semiconductor protection circuit
  • Patent Title (中): 半导体保护电路及其制造方法及半导体保护电路的运行方法
  • Application No.: US11902395
    Application Date: 2007-09-21
  • Publication No.: US07709898B2
    Publication Date: 2010-05-04
  • Inventor: Keita Takahashi
  • Applicant: Keita Takahashi
  • Applicant Address: JP Osaka
  • Assignee: Panasonic Corporation
  • Current Assignee: Panasonic Corporation
  • Current Assignee Address: JP Osaka
  • Agency: McDermott Will & Emery LLP
  • Priority: JP2007-040770 20070221
  • Main IPC: H01L23/62
  • IPC: H01L23/62
Semiconductor protection circuit, method for fabricating the same and method for operating semiconductor protection circuit
Abstract:
A protection circuit protects a semiconductor device provided on a semiconductor substrate and including an interconnect from charge entering the interconnect during fabrication of the semiconductor device. The protection circuit includes a first metal interconnect connected to the interconnect; a forward diode and a backward diode connected in parallel to the interconnect; an NMIS whose drain is connected to the output port of the forward diode, whose source is connected to the semiconductor substrate and whose gate is grounded through an upper metal interconnect; a PMIS whose drain is connected to the input port of the backward diode and whose source is connected to the semiconductor substrate; a first antenna connected to the gate of the NMIS; and a second antenna connected to the gate of the PMIS.
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