Invention Grant
- Patent Title: Semiconductor component and method
- Patent Title (中): 半导体元件及方法
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Application No.: US11604984Application Date: 2006-11-28
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Publication No.: US07709887B2Publication Date: 2010-05-04
- Inventor: Frank Hille , Frank Umbach , Anton Mauder , Hans-Joachim Schulze , Thomas Laska , Manfred Pfaffenlehner
- Applicant: Frank Hille , Frank Umbach , Anton Mauder , Hans-Joachim Schulze , Thomas Laska , Manfred Pfaffenlehner
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102005056426 20051128
- Main IPC: H01L29/76
- IPC: H01L29/76

Abstract:
A semiconductor component and method of making a semiconductor component is disclosed. In one embodiment, the semiconductor component includes a drift region of a first conductivity type, a body region of a second conductivity type, and a trench extending into the body region. A semiconductor region of the first conductivity type is in contact with the drift region and the body region and is arranged at a distance from the trench.
Public/Granted literature
- US20070152268A1 Semiconductor component and method Public/Granted day:2007-07-05
Information query
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