Various systems and methods for implementing multi-mode semiconductor devices are discussed herein. For example, a multi-mode semiconductor device is disclosed that includes a device package with a number of package pins. In addition, the device includes a semiconductor die or substrate with at least two IO buffers. One of the IO buffers is located a distance from a package pin and another of the IO buffers is located another distance from the package pin. One of the IO buffers includes first bond pad electrically coupled to a circuit implementing a first interface type and a floating bond pad, and the other IO buffer includes a second bond pad electrically coupled to a circuit implementing a second interface type. In some cases, the floating bond pad is electrically coupled to the circuit implementing the second interface type via a conductive interconnect, and the floating bond pad is electrically coupled to the package pin.