A light emitting device includes a package having a recess defined by an inner wall and a bottom surface and a lead terminal exposed at the bottom surface of the recess and protruded outward from the package. The lead terminal exposed at the bottom surface of the recess portion including a semiconductor light emitting element mounting region and a wire connecting region for connecting a conductive wire from the semiconductor light emitting element thereto. At least one of regions between the semiconductor light emitting element mounting region and the wire connecting region has a groove portion disposed in a position spaced apart from a peripheral edge portion of the lead terminal that is exposed at the bottom surface of the recess.