Invention Grant
- Patent Title: Microsystem comprising a deformable bridge
- Patent Title (中): 微系统包括可变形桥
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Application No.: US11663737Application Date: 2005-10-11
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Publication No.: US07709757B2Publication Date: 2010-05-04
- Inventor: Pierre-Louis Charvet
- Applicant: Pierre-Louis Charvet
- Applicant Address: FR Paris
- Assignee: Commissariat a l'Energie Atomique
- Current Assignee: Commissariat a l'Energie Atomique
- Current Assignee Address: FR Paris
- Agency: Oliff & Berridge, PLC
- Priority: FR0411408 20041026
- International Application: PCT/FR2005/002512 WO 20051011
- International Announcement: WO2006/045914 WO 20060504
- Main IPC: H01H57/00
- IPC: H01H57/00

Abstract:
The invention relates to a microsystem comprising a deformable bridge, the ends of which are connected to a substrate. According to the invention, at least one actuation electrode, which is solidly connected to the bridge, is disposed between the center of the bridge and one of the ends next to a counter electrode which is solidly connected to the substrate. The electrodes are intended to deform the deformable bridge such that a lower face of the bridge comes into contact with a contact element formed on the substrate.
Public/Granted literature
- US20070279831A1 Microsystem Comprising A Deformable Bridge Public/Granted day:2007-12-06
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