Invention Grant
- Patent Title: Shielding film, shielded printed circuit board, shielded flexible printed circuit board, method of manufacturing shielding film, and method of manufacturing shielded printed circuit board
- Patent Title (中): 屏蔽膜，屏蔽印刷电路板，屏蔽柔性印刷电路板，屏蔽膜制造方法和屏蔽印刷电路板的制造方法
-
Application No.: US11914291Application Date: 2006-05-10
-
Publication No.: US07709750B2Publication Date: 2010-05-04
- Inventor: Kazuhiro Hashimoto , Syohei Morimoto , Yoshinori Kawakami , Kenji Kamino , Satoshi Ebihara , Hideaki Tanaka , Takahisa Akatsuka
- Applicant: Kazuhiro Hashimoto , Syohei Morimoto , Yoshinori Kawakami , Kenji Kamino , Satoshi Ebihara , Hideaki Tanaka , Takahisa Akatsuka
- Applicant Address: JP Higashiosaka-shi JP Tokyo
- Assignee: Tatsuta System Electronics Co, Ltd.,Nippon Mektron, Ltd.
- Current Assignee: Tatsuta System Electronics Co, Ltd.,Nippon Mektron, Ltd.
- Current Assignee Address: JP Higashiosaka-shi JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2005-141872 20050513
- International Application: PCT/JP2006/309870 WO 20060510
- International Announcement: WO2006/121194 WO 20061116
- Main IPC: H05K9/00
- IPC: H05K9/00
Abstract:
The invention includes a shielding film, which does not have breakage of a metal layer, and has excellent abrasion resistance and blocking resistance, and does not crack. The cover film 7 is provided on one surface of a separation film 6a, and an adhesive layer 8a is formed on the surface of the cover film 7 opposite to the separation film 6a via the metal layer. The cover film 7 has at least one hard layer 7a and at least one soft layer 7b, and the surface of the cover film 7 facing the separation film 6a is composed of the hard layer 7a.
Public/Granted literature
Information query
