Method of producing electronic component comprising electrodes and ring residues

Invention Grant

US07709355B2 Method of producing electronic component comprising electrodes and ring residues 失效

Title translation: 制造电子元件的方法，包括电极和环残留物

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Patent Title: Method of producing electronic component comprising electrodes and ring residues
Patent Title (中): 制造电子元件的方法，包括电极和环残留物
Application No.: US12121427

Application Date: 2008-05-15
Publication No.: US07709355B2

Publication Date: 2010-05-04
Inventor: Naohiro Nakane , Kimio Takahashi
Applicant: Naohiro Nakane , Kimio Takahashi
Applicant Address: JP Tokyo
Assignee: Canon Kabushiki Kaisha
Current Assignee: Canon Kabushiki Kaisha
Current Assignee Address: JP Tokyo
Agency: Fitzpatrick, Cella, Harper & Scinto
Priority: JP2005-180554 20050621; JP2006-135071 20060515
Main IPC: H01L21/00
IPC: H01L21/00

Method of producing electronic component comprising electrodes and ring residues

Abstract:

There are provided an electronic component production method and an electronic component by which the number of scribing processes can be reduced and the productivity can be made higher while surely preventing short circuiting during the production. An electronic component including a short ring residue portion and a method of producing the electronic component are provided.

Abstract(Chinese):

提供了电子部件制造方法和电子部件，通过该电子部件的制造方法可以减少划线处理的数量，并且可以在确保防止生产中的短路的同时，提高生产率。提供了包括短环残留部分的电子部件和制造电子部件的方法。

Public/Granted literature

US20080220684A1 ELECTRONIC COMPONENT AND METHOD OF PRODUCING SAME Public/Granted day:2008-09-11

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备