Invention Grant
US07709187B2 High resolution imaging process using an in-situ image modifying layer
有权
使用原位图像修改层的高分辨率成像过程
- Patent Title: High resolution imaging process using an in-situ image modifying layer
- Patent Title (中): 使用原位图像修改层的高分辨率成像过程
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Application No.: US11551824Application Date: 2006-10-23
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Publication No.: US07709187B2Publication Date: 2010-05-04
- Inventor: Kaushal Patel , Wu-Song Huang , Margaret C. Lawson , Jaione Tirapu Azpiroz
- Applicant: Kaushal Patel , Wu-Song Huang , Margaret C. Lawson , Jaione Tirapu Azpiroz
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Wenjie Li
- Main IPC: G03F7/26
- IPC: G03F7/26
Abstract:
A method of forming a patterned material layer on a substrate. A photoresist layer is formed on the substrate followed by an image modifying material formed on the photoresist. The image modifying material is patterned to form an image modifying pattern. The image modifying pattern and underlying photoresist are then exposed to suitable radiation. The image modifying pattern modifies the image intensity within the photoresist layer beneath the image modifying pattern. The resulting pattern is then transferred into the substrate.
Public/Granted literature
- US20080145793A1 High Resolution Imaging Process Using an In-Situ Image Modifying Layer Public/Granted day:2008-06-19
Information query
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