Invention Grant
- Patent Title: Process for depositing polycrystalline silicon
- Patent Title (中): 多晶硅沉积工艺
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Application No.: US12352021Application Date: 2009-01-12
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Publication No.: US07708970B2Publication Date: 2010-05-04
- Inventor: Karl Hesse , Franz Schreieder
- Applicant: Karl Hesse , Franz Schreieder
- Applicant Address: DE Munich
- Assignee: Wacker Chemie
- Current Assignee: Wacker Chemie
- Current Assignee Address: DE Munich
- Agency: Brooks Kushman P.C.
- Priority: DE102008000052 20080114
- Main IPC: C01B33/02
- IPC: C01B33/02

Abstract:
Polycrystalline silicon is prepared by thermally decomposing a reaction gas comprising hydrogen and a silicon-containing gas in a reaction chamber containing heated silicon, depositing additional silicon thereon, and forming an offgas; andseparating the offgas into a first fraction comprising trichlorosilane and lower boiling chlorosilanes, and a second offgas fraction comprising components having a higher boiling point than trichlorosilane;recycling the first offgas fraction to the reaction gas of a polycrystalline silicon deposition; andseparating the second offgas fraction into tetrachlorosilane and a high boiler fraction of high boilers, optionally also containing some tetrachlorosilane, and supplying the high boiler fraction to the reaction gas of a silicon deposition and heating the reaction gas to a temperature which ensures that the high boiler fraction is present in gaseous form on entry into the reaction chamber of the deposition reactor.
Public/Granted literature
- US20090180944A1 Process For Depositing Polycrystalline Silicone Public/Granted day:2009-07-16
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