Invention Grant
- Patent Title: Imprint method and imprint apparatus
- Patent Title (中): 压印方法和压印装置
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Application No.: US12184372Application Date: 2008-08-01
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Publication No.: US07708927B2Publication Date: 2010-05-04
- Inventor: Nobuhito Suehira , Junichi Seki , Shingo Okushima
- Applicant: Nobuhito Suehira , Junichi Seki , Shingo Okushima
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2007-208266 20070809
- Main IPC: B29C43/02
- IPC: B29C43/02

Abstract:
An imprint method includes the steps of preparing a substrate, placing an uncured resin material on the substrate, preparing a mold having a first end and a second end, and placing the mold to oppose the substrate at a position not sandwiching the resin material. A first gap between the first end and the substrate and a second gap between the second end and the substrate are different from each other. Additional steps include imparting a relative movement between the substrate and the mold so that the resin material approaches the first end of the mold and enters through the first gap and fills at least a part of a space between the mold and the substrate, and changing at least one of the first and second gaps in the state that the resin material is present between the mold and the substrate.
Public/Granted literature
- US20090039550A1 IMPRINT METHOD AND IMPRINT APPARATUS Public/Granted day:2009-02-12
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