Invention Grant
- Patent Title: Cerium oxide abrasive and method of polishing substrates
- Patent Title (中): 氧化铈磨料和抛光底物的方法
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Application No.: US10960941Application Date: 2004-10-12
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Publication No.: US07708788B2Publication Date: 2010-05-04
- Inventor: Masato Yoshida , Toranosuke Ashizawa , Hiroki Terazaki , Yasushi Kurata , Jun Matsuzawa , Kiyohito Tanno , Yuuto Ootuki
- Applicant: Masato Yoshida , Toranosuke Ashizawa , Hiroki Terazaki , Yasushi Kurata , Jun Matsuzawa , Kiyohito Tanno , Yuuto Ootuki
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Co, Ltd.
- Current Assignee: Hitachi Chemical Co, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Griffin & Szipl, P.C.
- Priority: JP8-258766 19960930; JP8-258767 19960930; JP8-258768 19960930; JP8-258770 19960930; JP8-258774 19960930; JP8-258775 19960930; JP8-258776 19960930; JP8-258781 19960930; JP8-259138 19960930; JP9-014371 19970128; JP9-112396 19970430; JP9-207866 19970801
- Main IPC: C09G1/02
- IPC: C09G1/02 ; C09G1/04 ; C09K3/14

Abstract:
A cerium oxide abrasive slurry having, dispersed in a medium, cerium oxide particles whose primary particles have a median diameter of from 30 nm to 250 nm, a maximum particle diameter of 600 nm or smaller, and a specific surface area of from 7 to 45 m.2/g, and slurry particles have a median diameter of from 150 nm to 600 nm. The cerium oxide particles have structural parameter Y, representing an isotropic microstrain obtained by an X-ray Rietveld method (with RIETAN-94), of from 0.01 to 0.70, and structural parameter X, representing a primary particle diameter obtained by an X-ray Rietveld method (with RIETAN-94), of from 0.08 to 0.3. The cerium oxide abrasive slurry is made by a method of obtaining particles by firing at a temperature of from 600° C. to 900° C. and then pulverizing, then dispersing the resulting cerium oxide particles in a medium.
Public/Granted literature
- US20050085168A1 Cerium oxide abrasive and method of polishing substrates Public/Granted day:2005-04-21
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