Invention Grant
US07708618B2 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
失效
用于干燥，干燥抛光和洗涤半导体器件的方法和设备
- Patent Title: Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
- Patent Title (中): 用于干燥，干燥抛光和洗涤半导体器件的方法和设备
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Application No.: US11980667Application Date: 2007-10-31
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Publication No.: US07708618B2Publication Date: 2010-05-04
- Inventor: Hiromi Yajima , Yukio Imoto , Shoichi Kodama , Riichiro Aoki , Takashi Omichi , Toyomi Nishi , Tetsuji Togawa
- Applicant: Hiromi Yajima , Yukio Imoto , Shoichi Kodama , Riichiro Aoki , Takashi Omichi , Toyomi Nishi , Tetsuji Togawa
- Applicant Address: JP Tokyo JP Kanagawa-ken
- Assignee: Ebara Corporation,Kabushiki Kaisha Toshiba
- Current Assignee: Ebara Corporation,Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo JP Kanagawa-ken
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP1993-259396 19930921; JP1994-319289 19941129; JP1994-330209 19941206; JP1994-330210 19941206; JP1994-339165 19941228; JP1994-339166 19941228; JP1994-339167 19941228
- Main IPC: B24B51/00
- IPC: B24B51/00
Abstract:
A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.
Public/Granted literature
- US20080166949A1 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device Public/Granted day:2008-07-10
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