Invention Grant
- Patent Title: Assembly of eggcrate substructure for bond jigs
- Patent Title (中): 装配用于粘结夹具的蛋壳底部结构
-
Application No.: US11181182Application Date: 2005-07-13
-
Publication No.: US07708249B2Publication Date: 2010-05-04
- Inventor: Neal A. Froeschner , Daniel R. Benjey
- Applicant: Neal A. Froeschner , Daniel R. Benjey
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Yee & Associates, P.C.
- Agent Brett L. Halperin
- Main IPC: A47B91/00
- IPC: A47B91/00

Abstract:
A system for supporting a bond jig comprises a plurality of planar panels including at least one mounting hole for fasteners in each panel, wherein a first panel is arranged in a non-orthogonal position to a second panel. The system further comprises a coupling element for coupling panels, comprising a first and second planar portion, a hinge element connecting the first and second planar portion, wherein the first planar portion and the second planar portion rotate around the hinge element to form an angle, and at least one mounting hole for fasteners in the first and second planar portion. The system further comprises at least one fastener for fastening the first planar portion to the first panel via a mounting hole in the first planar portion and a mounting hole in the first panel and at least one fastener for fastening the second planar portion to the second panel via the mounting hole in the second planar portion and the mounting hole in the second panel.
Public/Granted literature
- US20070051863A1 Assembly of eggcrate substructure for bond jigs Public/Granted day:2007-03-08
Information query