Invention Grant
- Patent Title: Thermostatic expansion valve with bypass passage
- Patent Title (中): 带旁路通道的恒温膨胀阀
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Application No.: US11357632Application Date: 2006-02-17
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Publication No.: US07707844B2Publication Date: 2010-05-04
- Inventor: David B. Nestler , Mike Noble
- Applicant: David B. Nestler , Mike Noble
- Applicant Address: US MO St. Louis
- Assignee: Emerson Electric Co.
- Current Assignee: Emerson Electric Co.
- Current Assignee Address: US MO St. Louis
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: F25B41/04
- IPC: F25B41/04

Abstract:
A thermostatic expansion valve is provided comprising an inlet, an outlet, first and second flow paths through the valve, a first valve element in the first flow path between the inlet and outlet, and a movable diaphragm having a first side acted on by a first fluid pressure and a second side acted on by at least a second fluid pressure. The diaphragm is movable to permit increased flow through the first flow path when the force against the first side is greater than that against the second side, and is movable to restrict flow through the first flow path when the force against the first side is less than that against the second side. The diaphragm moves in an upward direction to cause the first valve element to close the first flow path, and may continue to move in the upward direction to cause a second flow path to open.
Public/Granted literature
- US20070194140A1 Thermostatic expansion valve Public/Granted day:2007-08-23
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