Invention Grant
US07707525B2 Reliability simulation method for a PCB assembly 有权
PCB组件的可靠性仿真方法

  • Patent Title: Reliability simulation method for a PCB assembly
  • Patent Title (中): PCB组件的可靠性仿真方法
  • Application No.: US11666498
    Application Date: 2007-03-07
  • Publication No.: US07707525B2
    Publication Date: 2010-04-27
  • Inventor: Abraham Varon-Weinryb
  • Applicant: Abraham Varon-Weinryb
  • Applicant Address: IL Rama Gan
  • Assignee: Expert Dynamics Ltd.
  • Current Assignee: Expert Dynamics Ltd.
  • Current Assignee Address: IL Rama Gan
  • Agency: Venable LLP
  • Agent Robert Kinberg; Todd R. Farnsworth
  • Priority: IL174186 20060308
  • International Application: PCT/IL2007/000295 WO 20070307
  • International Announcement: WO2007/102155 WO 20070913
  • Main IPC: G06F17/50
  • IPC: G06F17/50
Reliability simulation method for a PCB assembly
Abstract:
The present invention relates to a method for finding design weakness and potential field failure of a PCB assembly which includes components, comprising the steps of: (a) creating a model of the PCB assembly by which natural frequencies and mode shapes of the PCB assembly can be determined; (b) performing a natural frequencies simulation for determining natural frequencies and mode shapes of the PCB assembly; and (c) analyzing said determined natural frequencies and mode shapes and identifying local dominant oscillations of components, components identified as having a local dominant oscillation in at least one of said determined mode shapes are identified as components having a relatively high potential of field failure.
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