Invention Grant
- Patent Title: Reliability simulation method for a PCB assembly
- Patent Title (中): PCB组件的可靠性仿真方法
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Application No.: US11666498Application Date: 2007-03-07
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Publication No.: US07707525B2Publication Date: 2010-04-27
- Inventor: Abraham Varon-Weinryb
- Applicant: Abraham Varon-Weinryb
- Applicant Address: IL Rama Gan
- Assignee: Expert Dynamics Ltd.
- Current Assignee: Expert Dynamics Ltd.
- Current Assignee Address: IL Rama Gan
- Agency: Venable LLP
- Agent Robert Kinberg; Todd R. Farnsworth
- Priority: IL174186 20060308
- International Application: PCT/IL2007/000295 WO 20070307
- International Announcement: WO2007/102155 WO 20070913
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
The present invention relates to a method for finding design weakness and potential field failure of a PCB assembly which includes components, comprising the steps of: (a) creating a model of the PCB assembly by which natural frequencies and mode shapes of the PCB assembly can be determined; (b) performing a natural frequencies simulation for determining natural frequencies and mode shapes of the PCB assembly; and (c) analyzing said determined natural frequencies and mode shapes and identifying local dominant oscillations of components, components identified as having a local dominant oscillation in at least one of said determined mode shapes are identified as components having a relatively high potential of field failure.
Public/Granted literature
- US20080275672A1 Reliability Simulation Method and System Public/Granted day:2008-11-06
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