Invention Grant
- Patent Title: Carrier assembly for an integrated circuit
- Patent Title (中): 集成电路的载体组件
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Application No.: US12276390Application Date: 2008-11-23
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Publication No.: US07705452B2Publication Date: 2010-04-27
- Inventor: Kia Silverbrook
- Applicant: Kia Silverbrook
- Applicant Address: AU Balmain, New South Wales
- Assignee: Silverbrook Research Pty Ltd
- Current Assignee: Silverbrook Research Pty Ltd
- Current Assignee Address: AU Balmain, New South Wales
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A carrier assembly for an integrated circuit is described. The assembly includes a retainer for receiving the integrated circuit, and island defining portions surrounding the retainer. Each island defining portion is connected to neighboring island defining portions through a serpentine member. This arrangement allows resilient deflection between the island defining portions.
Public/Granted literature
- US20090073668A1 Carrier Assembly For An Integrated Circuit Public/Granted day:2009-03-19
Information query
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