Invention Grant
- Patent Title: Semiconductor device using Filled Tetrahedral semiconductor
- Patent Title (中): 使用填充四面体半导体的半导体器件
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Application No.: US11837932Application Date: 2007-08-13
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Publication No.: US07705400B2Publication Date: 2010-04-27
- Inventor: Tatsuo Shimizu , Kazushige Yamamoto
- Applicant: Tatsuo Shimizu , Kazushige Yamamoto
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-244459 20060908
- Main IPC: H01L27/01
- IPC: H01L27/01 ; H01L27/12 ; H01L31/0392

Abstract:
A semiconductor device provided with a filled tetrahedral semiconductor is formed by introducing impurity atoms S for substituting the component atoms of sites of lattice points and impurity atoms I to be inserted into interstitial sites of a host semiconductor where component atoms are bonded to form a tetrahedral bonding structure. Such a semiconductor device is made to show a high mobility level and a high current drive force as a semiconductor substance where impurity atoms S are made to have a valance electron agreeing with that of the component atoms of the host semiconductor as a result of charge transfer between impurity atoms S and impurity atoms I and impurity atoms I are bonded in a state of showing an electronic arrangement of a closed shell structure is used as channel material.
Public/Granted literature
- US20080061369A1 SEMICONDUCTOR DEVICE USING FILLED TETRAHEDRAL SEMICONDUCTOR Public/Granted day:2008-03-13
Information query
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