Invention Grant
US07701720B2 Electronic assembly and techniques for installing a heatsink in an electronic assembly
有权
用于在散热器中安装电子组件的电子装配和技术
- Patent Title: Electronic assembly and techniques for installing a heatsink in an electronic assembly
- Patent Title (中): 用于在散热器中安装电子组件的电子装配和技术
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Application No.: US11862848Application Date: 2007-09-27
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Publication No.: US07701720B2Publication Date: 2010-04-20
- Inventor: John L. Colbert , John S. Corbin, Jr. , Jason R. Eagle , Arvind K. Sinha , Christopher L. Tuma
- Applicant: John L. Colbert , John S. Corbin, Jr. , Jason R. Eagle , Arvind K. Sinha , Christopher L. Tuma
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Dillon & Yudell LLP
- Agent Roy W. Truelson
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A technique for installing a heatsink in an electronic assembly includes simultaneously applying force to multiple fastener assemblies that each retain a respective fastener in a body of the heatsink. The heatsink is then attached to the electronic assembly by actuating the fasteners while the force is simultaneously applied to the multiple fastener assemblies.
Public/Granted literature
- US20090083972A1 Electronic Assembly and Techniques for Installing a Heatsink in an Electronic Assembly Public/Granted day:2009-04-02
Information query
