Invention Grant
- Patent Title: Notebook computer having heat pipe
- Patent Title (中): 带热管的笔记本电脑
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Application No.: US12169639Application Date: 2008-07-09
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Publication No.: US07701717B2Publication Date: 2010-04-20
- Inventor: Nien-Tien Cheng , Yung-Fa Cheng , Rung-An Chen , Cheng-Jen Liang , Ching-Bai Hwang
- Applicant: Nien-Tien Cheng , Yung-Fa Cheng , Rung-An Chen , Cheng-Jen Liang , Ching-Bai Hwang
- Applicant Address: TW Tu-Cheng, Taipei Hsien
- Assignee: Foxconn Technology Co., Ltd.
- Current Assignee: Foxconn Technology Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, Taipei Hsien
- Agent Frank R. Niranjan
- Priority: CN200810066775 20080423
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A notebook computer includes a heat-generating component, a keyboard frame made of a heat conductive material and a heat pipe having an evaporator and a condenser. The evaporator of the heat pipe is in thermal communication with the heat-generating component and the condenser is attached to the keyboard frame and away from the heat-generating component.
Public/Granted literature
- US20090268392A1 NOTEBOOK COMPUTER HAVING HEAT PIPE Public/Granted day:2009-10-29
Information query
