Invention Grant
- Patent Title: Light emitting device having pixel portion surrounded by first sealing material and covered with second sealing material
- Patent Title (中): 发光装置,其像素部分由第一密封材料包围并被第二密封材料覆盖
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Application No.: US10465877Application Date: 2003-06-20
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Publication No.: US07700958B2Publication Date: 2010-04-20
- Inventor: Takeshi Nishi , Yasuo Nakamura
- Applicant: Takeshi Nishi , Yasuo Nakamura
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2002-197424 20020705
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L23/31

Abstract:
A light emitting device having a structure in which oxygen and moisture are prevented from reaching light emitting elements, and a method of manufacturing the same, are provided. Further, the light emitting elements are sealed by using a small number of process steps, without enclosing a drying agent. The present invention has a top surface emission structure. A substrate on which the light emitting elements are formed is bonded to a transparent sealing substrate. The structure is one in which a transparent second sealing material covers the entire surface of a pixel region when bonding the two substrates, and a first sealing material (having a higher viscosity than the second sealing material), which contains a gap material (filler, fine particles, or the like) for protecting a gap between the two substrates, surrounds the pixel region. The two substrates are sealed by the first sealing material and the second sealing material. Further, reaction between electrodes of the light emitting elements (cathodes or anodes) and the sealing materials can be prevented by covering the electrodes with a transparent protective layer, for example, CaF2, MgF2, or BaF2.
Public/Granted literature
- US20040004434A1 Light emitting device and method of manufacturing the same Public/Granted day:2004-01-08
Information query
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