Invention Grant
US07676711B2 Test circuit for testing command signal at package level in semiconductor device 失效
用于在半导体器件中封装级测试指令信号的测试电路

  • Patent Title: Test circuit for testing command signal at package level in semiconductor device
  • Patent Title (中): 用于在半导体器件中封装级测试指令信号的测试电路
  • Application No.: US11819566
    Application Date: 2007-06-28
  • Publication No.: US07676711B2
    Publication Date: 2010-03-09
  • Inventor: Hong-Sok Choi
  • Applicant: Hong-Sok Choi
  • Applicant Address: KR Gyeonggi-do
  • Assignee: Hynix Semiconductor, Inc.
  • Current Assignee: Hynix Semiconductor, Inc.
  • Current Assignee Address: KR Gyeonggi-do
  • Agency: IP & T Law Firm PLC
  • Priority: KR10-2006-0095169 20060928
  • Main IPC: G11C29/00
  • IPC: G11C29/00
Test circuit for testing command signal at package level in semiconductor device
Abstract:
A test circuit for testing a command signal at a package level in a semiconductor device includes: a logic level determining unit for determining logic levels of a plurality of command flag signals in response to a plurality of internal command signals in a test mode; a storage unit for storing the plurality of command flag signals in response to a store control signal and outputting the plurality of command flag signals in series in response to an output control signal; and an output unit for driving an output signal of the storage unit to a data pad.
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