Invention Grant
- Patent Title: Data transmission with bundling of multiple transmission channel facilities
- Patent Title (中): 数据传输与捆绑的多个传输通道设施
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Application No.: US11444742Application Date: 2006-05-31
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Publication No.: US07675947B2Publication Date: 2010-03-09
- Inventor: Friedrich Beckmann
- Applicant: Friedrich Beckmann
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102005024782 20050531
- Main IPC: H04J3/04
- IPC: H04J3/04
Abstract:
A device includes multiple separate transmission channel facilities including first and second transmission channel facilities each having a standard network interface unit configured to transmit bundling data. The device includes a facility configured to bundle transmission channel facilities and to transmit a sub-stream of a data stream to be transmitted via transmission channels to be bundled as a stream of bundling data via the standard network interface units between the first transmission channel facility and the second transmission channel facility.
Public/Granted literature
- US20060285549A1 Data transmission with bundling of multiple transmission channel facilities Public/Granted day:2006-12-21
Information query
