Invention Grant
- Patent Title: Electronic apparatus
- Patent Title (中): 电子仪器
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Application No.: US12356413Application Date: 2009-01-20
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Publication No.: US07675752B2Publication Date: 2010-03-09
- Inventor: Takeshi Hongo
- Applicant: Takeshi Hongo
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Knobbe, Martens, Olson & Bear LLP
- Priority: JP2008-020945 20080131
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28D15/00

Abstract:
According to one embodiment, a heat sink includes first and second fin units. Fins of the first fin unit are provided with a through-hole part in which a heat pipe is inserted. Fins of the second fin unit are provided with a cutout part cut out to avoid the heat pipe. The fins of the second fin unit are inserted in spaces between the fins of the first fin unit. The fins of the second fin unit reach to a region in which the fins of the second fin unit overlap the heat pipe in the first fin unit.
Public/Granted literature
- US20090195988A1 ELECTRONIC APPARATUS Public/Granted day:2009-08-06
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