A method for measuring structures (3) on a substrate (2) with a coordinate measuring machine (1) is disclosed. A predefined measuring method is used for measuring at least one structure (3) on the substrate (2), wherein the measuring includes the position and/or the width of the structure (3). The predefined measuring method consists of a plurality of processes linked with the coordinate system (1a) of the coordinate measuring machine (2). The measuring method for a substrate is defined by a first orientation with respect to the coordinate system of the coordinate measuring machine (1). The predefined measuring method is applied to a second orientation of the substrate (2).