Invention Grant
- Patent Title: Multi-system module having functional substrate
- Patent Title (中): 具有功能基板的多系统模块
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Application No.: US12007066Application Date: 2008-01-07
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Publication No.: US07675357B2Publication Date: 2010-03-09
- Inventor: Chung-Er Huang , Chih-Hao Liao
- Applicant: Chung-Er Huang , Chih-Hao Liao
- Applicant Address: TW Taipei
- Assignee: Azurewave Technologies, Inc.
- Current Assignee: Azurewave Technologies, Inc.
- Current Assignee Address: TW Taipei
- Agency: Rosenberg, Klein & Lee
- Main IPC: H01L25/00
- IPC: H01L25/00
Abstract:
A multi-system module having a functional substrate includes a substrate comprising therein at least one control circuit units, and a plurality of main circuit units provided on one side surface of the substrate. The main circuit units are electrically connected to the control circuit unit, whereby the control circuit unit is used to manage the operation of the main circuit units. Via the above module structure, the substrate can improve the function of controlling multiple systems.
Public/Granted literature
- US20090174463A1 Multi-system module having functional substrate Public/Granted day:2009-07-09
Information query
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