Invention Grant
- Patent Title: Dual-slice architectures for programmable logic devices
- Patent Title (中): 可编程逻辑器件的双切片架构
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Application No.: US12409757Application Date: 2009-03-24
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Publication No.: US07675321B1Publication Date: 2010-03-09
- Inventor: Om P. Agrawal , Xiaojie He , Sajitha Wijesuriya , Barry Britton , Ming H. Ding , Jun Zhao
- Applicant: Om P. Agrawal , Xiaojie He , Sajitha Wijesuriya , Barry Britton , Ming H. Ding , Jun Zhao
- Applicant Address: US OR Hillsboro
- Assignee: Lattice Semiconductor Corporation
- Current Assignee: Lattice Semiconductor Corporation
- Current Assignee Address: US OR Hillsboro
- Main IPC: H01L25/00
- IPC: H01L25/00 ; G06F7/38

Abstract:
In one embodiment of the invention, a programmable logic device includes a plurality of programmable logic blocks and a plurality of dual-slice logic blocks within a programmable logic block. A dual-slice logic block includes a first slice including at least two lookup tables (LUTs); a second slice including at least two LUTs; and a routing circuit coupled to each of the LUTs within the first and second slices. The routing circuit is adapted to share outputs of the dual-slice logic block among the LUTs. In another embodiment of the invention, the dual-slice logic block includes a second routing circuit coupled to each of the LUTs within the first and second slices. The second routing circuit is adapted to share inputs of the dual-slice logic block among the LUTs.
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