Invention Grant
- Patent Title: Light emitting diode display device comprising a high temperature resistant overlay
- Patent Title (中): 包括耐高温覆盖层的发光二极管显示装置
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Application No.: US10779116Application Date: 2004-02-13
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Publication No.: US07675231B2Publication Date: 2010-03-09
- Inventor: Elizabeth Ching Ling Fung , Kee Yean Ng , Hong Hust Yeoh
- Applicant: Elizabeth Ching Ling Fung , Kee Yean Ng , Hong Hust Yeoh
- Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.
- Main IPC: H01J1/62
- IPC: H01J1/62 ; H01K1/32
Abstract:
A light emitting diode display device includes a substrate having a first conductive portion and a second conductive portion. A light emitting diode die is coupled to the first conductive portion. A wire bond is coupled to the light emitting diode die and coupled to the second conductive portion. An encapsulant encases the light emitting diode die and the wire bond above the substrate. An overlay is above the encapsulant, wherein the overlay has a high glass transition temperature.
Public/Granted literature
- US20050179376A1 Light emitting diode display device Public/Granted day:2005-08-18
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