Invention Grant
- Patent Title: Piezoelectric vibrating reed and piezoelectric device
- Patent Title (中): 压电振动片和压电器件
-
Application No.: US11380273Application Date: 2006-04-26
-
Publication No.: US07675224B2Publication Date: 2010-03-09
- Inventor: Hideo Tanaya
- Applicant: Hideo Tanaya
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2005-129907 20050427
- Main IPC: H01L41/04
- IPC: H01L41/04 ; H01L41/053

Abstract:
There is provided a piezoelectric vibrating reed, including: a base formed of a piezoelectric material and having a predetermined length; a plurality of vibrating arms extended from one side of the base; a support arm extended in a width direction from the other side spaced apart from the one side of the base by a predetermined interval and extended outside the vibrating arms in the same direction as the vibrating arms; and a cut portion formed of the piezoelectric material reduced in its width direction at a location closer to the vibrating arms than a connection portion where the support arms are connected to the base as one body, wherein a through-hole is also disposed at a location closer to the vibrating arms than the connection portion where the support arms are connected to the base as one body.
Public/Granted literature
- US20070024163A1 PIEZOELECTRIC VIBRATING REED AND PIEZOELECTRIC DEVICE Public/Granted day:2007-02-01
Information query
IPC分类: