Invention Grant
- Patent Title: Electronic device package heat sink assembly
- Patent Title (中): 电子装置封装散热器组件
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Application No.: US11452126Application Date: 2006-06-13
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Publication No.: US07675167B2Publication Date: 2010-03-09
- Inventor: Herbert W. Schlomann
- Applicant: Herbert W. Schlomann
- Applicant Address: US NJ Hackensack
- Assignee: Electro Ceramic Industries
- Current Assignee: Electro Ceramic Industries
- Current Assignee Address: US NJ Hackensack
- Agency: Howard IP Law Group, PC
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/10
Abstract:
An electronic package includes a flat base having a notch formed at opposite ends of the base. A clamping mechanism has a boss adapted to the notch for matingly connecting to the base, and includes an aperture for receiving a fastener for securing the package to a substrate or heat sink.
Public/Granted literature
- US20060279934A1 Electronic device package heat sink assembly Public/Granted day:2006-12-14
Information query
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