Invention Grant
- Patent Title: Electric circuit device and related manufacturing method
- Patent Title (中): 电路装置及相关制造方法
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Application No.: US11806675Application Date: 2007-06-01
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Publication No.: US07675150B2Publication Date: 2010-03-09
- Inventor: Tohru Nomura
- Applicant: Tohru Nomura
- Applicant Address: JP Kariya
- Assignee: Denso Corporation
- Current Assignee: Denso Corporation
- Current Assignee Address: JP Kariya
- Agency: Nixon & Vanderhye
- Priority: JP2006-154433 20060602
- Main IPC: H01L21/302
- IPC: H01L21/302

Abstract:
An electric circuit device and related manufacturing method are disclosed as having a case incorporating therein a substrate on which electric circuit elements are mounted. A sealant is filled in the case to cover the electric circuit elements and the substrate and is composed of a lower layer gel and an upper layer gel formed in a two-layer structure. The upper layer gel has a penetration equal to or less than 90 and the lower layer gel has a penetration greater than that of the upper layer gel to allow the upper layer gel to suppress vibration of a surface of the lower gel for thereby suppressing the deformation of the lower layer gel even in the presence of a tendency causing the electric circuit elements or the substrate to vibrate, preventing a degraded function in insulation, waterproof and vibrational relaxation of the lower layer gel.
Public/Granted literature
- US20070278623A1 Electric circuit device and related manufacturing method Public/Granted day:2007-12-06
Information query
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