Invention Grant
US07675146B2 Semiconductor device with leadframe including a diffusion barrier
有权
具有引线框架的半导体器件包括扩散阻挡层
- Patent Title: Semiconductor device with leadframe including a diffusion barrier
- Patent Title (中): 具有引线框架的半导体器件包括扩散阻挡层
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Application No.: US11851977Application Date: 2007-09-07
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Publication No.: US07675146B2Publication Date: 2010-03-09
- Inventor: Reimund Engl , Michael Bauer
- Applicant: Reimund Engl , Michael Bauer
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A semiconductor device includes a leadframe having a first face and an opposing second face, a portion of the first face defining a die pad, a diffusion barrier deposited on at least a portion of the die pad, and at least one chip coupled to the diffusion barrier.
Public/Granted literature
- US20090065914A1 SEMICONDUCTOR DEVICE WITH LEADERFRAME INCLUDING A DIFFUSION BARRIER Public/Granted day:2009-03-12
Information query
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