Invention Grant
US07675144B2 Method of making wireless semiconductor device, and leadframe used therefor
有权
制造无线半导体器件的方法和用于其的引线框架
- Patent Title: Method of making wireless semiconductor device, and leadframe used therefor
- Patent Title (中): 制造无线半导体器件的方法和用于其的引线框架
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Application No.: US11085116Application Date: 2005-03-22
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Publication No.: US07675144B2Publication Date: 2010-03-09
- Inventor: Yoshitaka Horie
- Applicant: Yoshitaka Horie
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Paul, Hastings, Janofsky & Walker LLP
- Priority: JP2000-230971 20000731; JP2001-73569 20010315
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A method of making a semiconductor device is provided. The method includes the following steps. First, a semiconductor chip is mounted on a lower conductor, with first solder material applied between the chip and the lower conductor. Then, an upper conductor is placed on the chip, with second solder material applied between the chip and the upper conductor. Then, the first and the second solder materials are heated up beyond their respective melting points. Finally, the first and the second solder materials are allowed to cool down, so that the first solder material solidifies earlier than the second solder material.
Public/Granted literature
- US20050161777A1 Method of making wireless semiconductor device, and leadframe used therefor Public/Granted day:2005-07-28
Information query
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