Invention Grant
- Patent Title: Semiconductor element, semiconductor device and mounting board
- Patent Title (中): 半导体元件，半导体器件和安装板
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Application No.: US11976792Application Date: 2007-10-29
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Publication No.: US07675143B2Publication Date: 2010-03-09
- Inventor: Takahide Kadoyama , Masayoshi Abe , Atsushi Kamo , Takaaki Yamada , Chihiro Arai
- Applicant: Takahide Kadoyama , Masayoshi Abe , Atsushi Kamo , Takaaki Yamada , Chihiro Arai
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rader, Fishman & Grauer PLLC
- Priority: JP2006-296532 20061031; JP2007-093349 20070330
- Main IPC: H01L23/552
- IPC: H01L23/552
Abstract:
A semiconductor element capable of reducing noises of a circuit propagating to another circuit through a seal ring is provided. A semiconductor element includes, on a surface of a semiconductor substrate: a plurality of circuits; a ring-shaped seal ring surrounding the plurality of circuits; and wiring connecting between the seal ring and an external low-impedance node.
Public/Granted literature
- US20080099886A1 Semiconductor element, semiconductor device and mounting board Public/Granted day:2008-05-01
Information query
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