Invention Grant
US07674987B2 Multilayer printed circuit board 有权
多层印刷电路板

Multilayer printed circuit board
Abstract:
The multilayer printed circuit board according to the present invention is a multilayer printed circuit board, in which conductor circuits and insulating layers are formed and layered, an optical path for transmitting an optical signal comprising a resin composite is formed, and conductor circuits are formed on an outermost insulating layer. Herein, an end portion of the above described optical path for transmitting an optical signal protrudes from the surface of the outermost insulating layer.
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