Invention Grant
- Patent Title: Multilayer printed circuit board
- Patent Title (中): 多层印刷电路板
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Application No.: US11693188Application Date: 2007-03-29
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Publication No.: US07674987B2Publication Date: 2010-03-09
- Inventor: Hiroaki Kodama , Kazuhito Yamada
- Applicant: Hiroaki Kodama , Kazuhito Yamada
- Applicant Address: JP Ogaki-shi
- Assignee: Ibiden Co., Ltd.
- Current Assignee: Ibiden Co., Ltd.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H05K1/16
- IPC: H05K1/16

Abstract:
The multilayer printed circuit board according to the present invention is a multilayer printed circuit board, in which conductor circuits and insulating layers are formed and layered, an optical path for transmitting an optical signal comprising a resin composite is formed, and conductor circuits are formed on an outermost insulating layer. Herein, an end portion of the above described optical path for transmitting an optical signal protrudes from the surface of the outermost insulating layer.
Public/Granted literature
- US20080236876A1 MULTILAYER PRINTED CIRCUIT BOARD Public/Granted day:2008-10-02
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