Invention Grant
- Patent Title: Circuit board structure having capacitor array and embedded electronic component and method for fabricating the same
- Patent Title (中): 具有电容器阵列和嵌入式电子部件的电路板结构及其制造方法
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Application No.: US11537417Application Date: 2006-09-29
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Publication No.: US07674986B2Publication Date: 2010-03-09
- Inventor: Chia-Wei Chang , Chung-Cheng Lien
- Applicant: Chia-Wei Chang , Chung-Cheng Lien
- Applicant Address: TW Hsin-Chu
- Assignee: Phoenix Precision Technology Corporation
- Current Assignee: Phoenix Precision Technology Corporation
- Current Assignee Address: TW Hsin-Chu
- Agency: Foley & Lardner LLP
- Priority: TW94145810A 20051222
- Main IPC: H05K1/16
- IPC: H05K1/16

Abstract:
A circuit board structure having a capacitor array and an embedded electronic component and a method for fabricating the same are proposed. Two carrier boards and a high dielectric constant material layer are provided, wherein the carrier boards have electronic components embedded therein and one surface of each carrier board has a plurality of electrode plates. The two carrier boards are laminated with the dielectric constant material layer interposed between them. The electrode plates on the surfaces of the carrier boards are opposite to each other across the high dielectric constant material layer to constitute a capacitor array. Therefore, the capacitor assembly for design of electronic devices is provided.
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