Invention Grant
- Patent Title: Wiring board
- Patent Title (中): 接线板
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Application No.: US11426399Application Date: 2006-06-26
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Publication No.: US07674984B2Publication Date: 2010-03-09
- Inventor: Tomoyuki Kubo
- Applicant: Tomoyuki Kubo
- Applicant Address: JP Nagoya-shi, Aichi-ken
- Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee Address: JP Nagoya-shi, Aichi-ken
- Agency: Baker Botts L.L.P.
- Priority: JP2005-192369 20050630
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
In order to prevent stress caused by bending a flexible wiring board from being applied to the connection section between the flexible wiring board and a driving IC, solder is deposited as a reinforcement member, on both sides of the driving IC connected onto the flexible wiring board.
Public/Granted literature
- US20070003744A1 Wiring Board Public/Granted day:2007-01-04
Information query
