Invention Grant
US07674865B2 Photosemiconductor encapsulant of epoxy resin, anhydride and aromatic silicone resin
有权
环氧树脂，酸酐和芳香族有机硅树脂的光半导体密封剂
- Patent Title: Photosemiconductor encapsulant of epoxy resin, anhydride and aromatic silicone resin
- Patent Title (中): 环氧树脂，酸酐和芳香族有机硅树脂的光半导体密封剂
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Application No.: US11364191Application Date: 2006-03-01
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Publication No.: US07674865B2Publication Date: 2010-03-09
- Inventor: Hisataka Ito
- Applicant: Hisataka Ito
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JPP.2005-056028 20050301
- Main IPC: C08K5/13
- IPC: C08K5/13 ; C08K5/17 ; C08K5/36 ; C08K5/49 ; C08L63/00 ; C08L63/02 ; C08L63/06 ; H01L23/29
Abstract:
An epoxy resin composition for photosemiconductor element encapsulation, which is excellent in both light transmissibility and low stress property, as well as light resistance against short wavelength light (for example, 350 to 500 nm), is provided. The epoxy resin composition for photosemiconductor element encapsulation, which comprises the following components (A) to (C): (A) an epoxy resin, (B) an acid anhydride curing agent, and (C) a specific silicone resin.
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