Invention Grant
- Patent Title: Fabrication of sealed high temperature superconductor wires
- Patent Title (中): 密封高温超导电线的制造
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Application No.: US11490779Application Date: 2006-07-21
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Publication No.: US07674751B2Publication Date: 2010-03-09
- Inventor: Alexis P. Malozemoff , Martin W. Rupich , Douglas C. Folts
- Applicant: Alexis P. Malozemoff , Martin W. Rupich , Douglas C. Folts
- Applicant Address: US MA Westborough
- Assignee: American Superconductor Corporation
- Current Assignee: American Superconductor Corporation
- Current Assignee Address: US MA Westborough
- Agency: Wilmer Cutler Pickering Hale & Dorr LLP.
- Main IPC: H01L39/24
- IPC: H01L39/24 ; H01B12/00 ; H01L39/00

Abstract:
A method of making a laminated superconductor wire includes providing an assembly, where the assembly includes a substrate; a superconductor layer overlaying a surface of the substrate, the superconductor layer having a defined pattern; and a cap layer; and slitting the assembly in accordance with the defined pattern of the superconductor layer to form a sealed wire. Slitting the assembly in accordance with the defined pattern may form multiple sealed wires, and the substrate may be substantially wider than the sealed wires.
Public/Granted literature
- US20070179063A1 Fabrication of sealed high temperature superconductor wires Public/Granted day:2007-08-02
Information query
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