Invention Grant
- Patent Title: Patterning method for light-emitting devices
- Patent Title (中): 发光装置的图案化方法
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Application No.: US11876334Application Date: 2007-10-22
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Publication No.: US07674712B2Publication Date: 2010-03-09
- Inventor: Ronald S. Cok
- Applicant: Ronald S. Cok
- Agency: Morgan Lewis & Bockius LLP
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/76
Abstract:
A method of patterning a substrate by mechanically locating a first masking film over the substrate; removing one or more first opening portions in first locations in the first masking film to form one or more first masking portions in the first masking film. First materials are deposited over the substrate in the first locations to form first patterned areas before mechanically locating a second masking film over the substrate and first masking portions. One or more second opening portions are removed from second locations, different from the first locations, in both the second masking film and the first masking portions to form one or more second masking portions. Second materials are deposited over the substrate in the second locations to form second patterned areas.
Public/Granted literature
- US20090104785A1 PATTERNING METHOD FOR LIGHT-EMITTING DEVICES Public/Granted day:2009-04-23
Information query
IPC分类:
