Invention Grant
US07674352B2 System and method for depositing a gaseous mixture onto a substrate surface using a showerhead apparatus
失效
使用喷头装置将气态混合物沉积到基材表面上的系统和方法
- Patent Title: System and method for depositing a gaseous mixture onto a substrate surface using a showerhead apparatus
- Patent Title (中): 使用喷头装置将气态混合物沉积到基材表面上的系统和方法
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Application No.: US11564198Application Date: 2006-11-28
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Publication No.: US07674352B2Publication Date: 2010-03-09
- Inventor: David Bour , Lori Washington , Sandeep Nijhawan , Ronald Stevens , Jacob Smith , Alexander Tam , Nyi Oo Myo , Steve Park , Rosemary Twist , Garry Kwong , Jie Su
- Applicant: David Bour , Lori Washington , Sandeep Nijhawan , Ronald Stevens , Jacob Smith , Alexander Tam , Nyi Oo Myo , Steve Park , Rosemary Twist , Garry Kwong , Jie Su
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Townsend and Townsend and Crew, LLP
- Main IPC: C23F1/00
- IPC: C23F1/00 ; H01L21/306

Abstract:
A gaseous mixture is deposited onto a substrate surface using a showerhead. A first plenum of the showerhead has a plurality of channels fluidicly coupled with an interior of a processing chamber. A second plenum gas flows through a plurality of tubes extending from a second plenum of the showerhead through the channels into the interior of the processing chamber. The diameter of the tubes is smaller than the diameter of the channels such that a first plenum gas flows into the interior of the processing chamber through a space defined between the outer surface of the tubes and the surface of the channels. The length and diameter of the tubes determine the level of distribution and the molar ratio of the first gas and the second gas in the gaseous mixture that is deposited on the surface of the substrate.
Public/Granted literature
- US20080124463A1 SYSTEM AND METHOD FOR DEPOSITING A GASEOUS MIXTURE ONTO A SUBSTRATE SURFACE USING A SHOWERHEAD APPARATUS Public/Granted day:2008-05-29
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