Invention Grant
US07673670B2 Semifinished joint plate, joint plate, process for fabricating joint plate and heat exchanger
有权
半成品接头板,接头板,接头板和热交换器的制造工艺
- Patent Title: Semifinished joint plate, joint plate, process for fabricating joint plate and heat exchanger
- Patent Title (中): 半成品接头板,接头板,接头板和热交换器的制造工艺
-
Application No.: US10583375Application Date: 2005-03-08
-
Publication No.: US07673670B2Publication Date: 2010-03-09
- Inventor: Naohisa Higashiyama , Kenji Tsunoda
- Applicant: Naohisa Higashiyama , Kenji Tsunoda
- Applicant Address: JP Tokyo
- Assignee: Showa Denko K.K.
- Current Assignee: Showa Denko K.K.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2004-065615 20040309; JP2005-061857 20050307
- International Application: PCT/JP2005/004409 WO 20050308
- International Announcement: WO2005/085739 WO 20050915
- Main IPC: F28D1/053
- IPC: F28D1/053

Abstract:
A semifinished joint plate 60 has a refrigerant inlet portion 45 and a refrigerant outlet portion 46 spaced apart in the front-rear direction. The semifinished plate 60 has an upwardly or downwardly extending slit 61 formed between the inlet portion 45 and the outlet portion 46, and slit width adjusting portions 62, 63 extending through the thickness of the plate 60, having a larger width than the slit 61 and communicating respectively with the upper and lower ends of the slit 61. A portion of the semifinished plate 60 above the upper adjusting portion 62 and a portion thereof below the lower adjusting portion 63 are bent to shorten the plate.
Public/Granted literature
- US20070215331A1 Semifinished Joint Plate, Joint Plate, Process for Fabricating Joint Plate and Heat Exchanger Public/Granted day:2007-09-20
Information query