Invention Grant
- Patent Title: System and method for high power laser processing
- Patent Title (中): 大功率激光加工的系统和方法
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Application No.: US11483326Application Date: 2006-07-07
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Publication No.: US07672343B2Publication Date: 2010-03-02
- Inventor: David C. Brown
- Applicant: David C. Brown
- Applicant Address: US MA Bedford
- Assignee: GSI Group Corporation
- Current Assignee: GSI Group Corporation
- Current Assignee Address: US MA Bedford
- Agency: Gauthier & Connors LLP
- Main IPC: H01S3/121
- IPC: H01S3/121

Abstract:
A high power laser processing system is disclosed that includes a laser source and at least one optical element. The laser source provides a high power laser illumination of a first wavelength. The optical element includes a substrate that is substantially transparent to the first wavelength illumination, at least one highly reflective coating on a first side of the substrate, and at least one anti-reflective coating on a second side of the substrate.
Public/Granted literature
- US20070029289A1 System and method for high power laser processing Public/Granted day:2007-02-08
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